Semiconductor integrated circuit device and process for producin

Fishing – trapping – and vermin destroying

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Details

437189, 437192, 357 71, H01L 21441, H01L 21469

Patent

active

049006959

ABSTRACT:
The present invention relates to a semiconductor integrated circuit device and a process for producing the same. A hole is bored in an insulating film above a portion of a wiring which is to be connected to another wiring by means of a focused ion beam. The inside of the hole and a predetermined region on the insulating film are irradiated with either a laser beam or an ion beam in a metal compound gas to deposit metal in the hole and on said region and a connecting wiring is formed by means of optically pumped CVD. To electrically connect upper- and lower-level wirings in a multilayer wiring structure by a connecting wiring, the connecting wiring is electrically isolated from an intermediate-level wiring through which it extends. The above-described arrangement enables provision of a hole with a focused ion beam and formation of a metal wiring on a selective region by means, for example, optically pumped CVD. Accordingly, it is possible to effect fine machining and electrically connect together wirings inside an LSI after the completion thereof. It is therefore possible to carry out debugging, repair and a defect analysis of the LSI.

REFERENCES:
patent: 4630357 (1986-12-01), Rogers et al.
patent: 4675979 (1987-06-01), Lade et al.
patent: 4675980 (1987-06-01), Lade et al.

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