Semiconductor integrated circuit device and a method for manufac

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257372, 257509, 257655, H01L 2702

Patent

active

055085490

ABSTRACT:
An improved arrangement is provided for forming a bipolar transistor on a substrate with CMOS elements. All of the transistors (i.e., the bipolar, P-MOS and N-MOS) are formed in regions having gradually decreasing impurity concentrations from the surface toward the substrate. In addition, a buried layer is provided under each of the regions of decreasing impurity concentration in which the transistors are formed. These buried layers have a significantly higher impurity concentration than the portion of the region of decreasing impurity concentration which they are respectively adjacent to. Using this arrangement, punch-through is prevented and excellent electrical operating characteristics are provided for both the bipolar transistors and the CMOS elements.

REFERENCES:
patent: 4399519 (1983-08-01), Masuda et al.
patent: 4434543 (1984-03-01), Schwabe et al.
patent: 4435895 (1984-03-01), Parrillo et al.
patent: 4484388 (1984-11-01), Iwasaki
patent: 4497106 (1985-02-01), Momma et al.
patent: 4528581 (1985-07-01), Lee
patent: 4684971 (1987-08-01), Payne
patent: 4980744 (1990-12-01), Watanabe et al.
patent: 5049967 (1991-09-01), Watanabe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor integrated circuit device and a method for manufac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor integrated circuit device and a method for manufac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit device and a method for manufac will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-327255

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.