Semiconductor integrated circuit device

Details Semiconductor integrated circuit device Semiconductor integrated circuit device

2006-12-12

2006-12-12

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S784000, C257SE25031, C257SE25032

Reexamination Certificate

active

07148567

ABSTRACT:
A semiconductor integrated circuit device has two semiconductor integrated circuit chips (20and30) respectively provided with a plurality of PADs (40a–40e,41a–41eand42a–42d), a plurality of LEADs (50a–50d) disposed around arrays of the semiconductor integrated circuit chips, and a plurality of bonding wires (60a–60eand61a–61d). The plurality of bonding wires are connected so as not to straddle one semiconductor integrated circuit chip (30) and allow wiring between the PADs (40a–40e) of the other semiconductor integrated circuit chip (20) and the LEADs (50a–50d).

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Japanese Office Action, with English-language translation, dated Jul. 13, 2006.
Japanese Office Action, dated Sep. 26, 2006, with English-language translation.

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