Semiconductor integrated circuit device

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365 63, G11C 502

Patent

active

061341363

ABSTRACT:
Reducing the chip area while improving the manufacturing efficiency as well as reducing costs in a semiconductor integrated circuit device such as a thermal head driver IC. A plurality of terminal electrodes were provided within an external data input/output circuit with an input terminal and output terminal being electrically connected to each other. In addition, an input/output protection circuit was provided to a respective one of such plurality of terminal electrodes with the input terminal and output terminal electrically connected together.

REFERENCES:
patent: 5807791 (1998-09-01), Bertin et al.
patent: 5936876 (1999-08-01), Sugasawara
patent: 5983331 (1999-11-01), Akamatsu et al.

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