Semiconductor integrated circuit device

Details Semiconductor integrated circuit device Semiconductor integrated circuit device

1997-12-22

1999-04-06

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257774, 257782, 257673, 257690, H01L 2348, H01L 2352

Patent

active

058922881

ABSTRACT:
To provide a slim and miniaturized semiconductor integrated circuit device which eliminates the needs for making through holes and conducting in through holes and uses a carrier substrate with a small thermal expansion coefficient difference from a semiconductor chip. A semiconductor integrated circuit device using a carrier substrate having a plurality of extraction conductive layers 3 formed as a single layer on an insulating base body 11 having a thermal expansion coefficient of 4.times.10.sup.-6 .degree. C..sup.-1 to 16.times.10.sup.-6 .degree. C..sup.-1 and comprising a plurality of ball-like external connection terminals 7 in a plurality of closed-end holes 15 arriving at external connection parts 4, each of the external connection terminals 7 having a diameter larger than the depth of each of the closed-end holes 15.

REFERENCES:
patent: 5583376 (1996-12-01), Sickler et al.
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5726489 (1998-03-01), Matsuda et al.
patent: 5753974 (1998-05-01), Masukawa

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