Semiconductor integrated circuit and fabrication method therefor

Details Semiconductor integrated circuit and fabrication method therefor Semiconductor integrated circuit and fabrication method therefor

1996-12-03

1999-03-30

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257207, 257355, 257369, H01L 2704, H01L 27118

Patent

active

058893342

ABSTRACT:
A semiconductor integrated circuit and a fabrication method therefor has the configuration that the number of pad driver cells 21 to 23 are equal to or more than the number of input/output control circuits 11 to 13, poly-silicon wirings 111 to 113 are connected to an input terminal IN and output terminals CP and CN in each of the input/output control circuit 11 to 13 in a wiring region LIN and poly-silicon wirings 211 to 233 are connected to input terminals CP and CN and an output terminal IN of each of the pad driver cells 21 to 23 in the wiring region, and the poly-silicon wirings 111 to 133 are connected to poly-silicon wirings 211 to 233 through aluminum wirings.

REFERENCES:
patent: 5455460 (1995-10-01), Hongo et al.

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