Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2011-08-02
2011-08-02
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257SE21503, C257S773000, C257S776000
Reexamination Certificate
active
07989964
ABSTRACT:
On a semiconductor chip in a semiconductor integrated circuit, a plurality of circuit cells each of which has a pad are formed along a first chip side of the semiconductor chip. Among the plurality of circuit cells, one or more circuit cells at least in the vicinity of an end portion on the first chip side are arranged having a steplike shift in a direction apart from the first chip side with decreasing distance from the center portion to the end portion on the first chip side.
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Ando Hiroshi
Kaneda Jinsaku
Maeda Eisaku
Maejima Akihiro
Matsunaga Hiroki
Chu Chris
McDermott Will & Emery LLP
Panasonic Corporation
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