Semiconductor inspecting apparatus

Details Semiconductor inspecting apparatus Semiconductor inspecting apparatus

1997-03-28

1999-08-10

Brown, Glenn W.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, G01R 1067

Patent

active

059364203

ABSTRACT:
The semiconductor inspecting apparatus can inspect a semiconductor device on which a plurality of product chips and a single TEG (test element group) chip are formed in the same step. The semiconductor inspecting apparatus includes a stage (2) for mounting a semiconductor wafer (1) on which product chips (A) and TEG chips (T) for inspecting the characteristics of the product chips (A) are arranged repeatedly; and a prober (3) for inspecting the defectiveness or non-defectiveness of each product chip and further printing an inspection result mark on the inspected product chip, respectively, when the stage is moved or scanned relative to the probe. The semiconductor inspecting apparatus is characterized in that a plurality of the product chips and a single TEG chip are formed on the semiconductor chip at the same step; and in that the apparatus further comprises a stage control section (4) for setting a number of length units selected from a length unit of a unit block, a length unit of the product chip, a length unit of the TEG chip, and combinations of these length units, as a movement unit of the stage, and for controllably moving the stage on the basis of the set length unit.

REFERENCES:
patent: 4786867 (1988-11-01), Yamatsu
patent: 4965515 (1990-10-01), Karasawa
patent: 4985676 (1991-01-01), Karasawa
patent: 5521522 (1996-05-01), Abe et al.

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