Semiconductor encapsulation method

Details Semiconductor encapsulation method Semiconductor encapsulation method

1996-05-28

1999-07-27

Picardat, Kevin M.

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

438455, 438458, H01L 2130

Patent

active

059306521

ABSTRACT:
An encapsulant (17) is applied to a semiconductor wafer (16). The bottom surface (28) of the wafer (16) is held substantially planar while curing the encapsulant (17). The bottom surface (28) is held against a substantially planar support plate (12) to facilitate holding the wafer (16) substantially planar. A polisher plate (18) is pressed against the encapsulant (17) to assist ensuring that the encapsulant has a substantially smooth surface and substantially uniform thickness.

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ChipScale Staff, "Micro SMT.TM. Chip Scale Packaging for Integrated Circuits", ChipScale, Inc., 1995, pp. 1-13.
D. Richmond, "Micro SMT Integrated Circuit Technical White Paper", Micro SMT, Inc., Jan. 1993, pp. 1-17.
D. Richmond, "Micro SMT Discrete Device White Paper", Micro SMT, Inc., May 1993, pp. 1-14.

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