Coating processes
With pretreatment of the base
Preapplied reactant or reaction promoter or hardener
Inventor
active
Electronic component and method of manufacture
Flexible substrate for packaging a semiconductor component
GaN LED with solderable backside metal
GaN LED with solderable backside metal
Method of adhesion to a polyimide surface by formation of covale
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Profile ID: LFUS-PAI-P-16445