Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2011-03-22
2011-03-22
Feely, Michael J (Department: 1761)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C523S468000
Reexamination Certificate
active
07910638
ABSTRACT:
A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 μm, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.
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Machine translation of JP 2008-121010 A, provided by the JPO website (no date).
Machine translation of JP 2005-112880 A, provided by the JPO website (no date).
Machine translation of JP 2005-036062 A, provided by the JPO website (no date).
Machine translation of JP 2003-337129 A, provided by the JPO website (no date).
Patent Abstracts of Japan: 2006-282700 A (no date).
Patent Abstracts of Japan: 2006-089670 A (no date).
Patent Abstracts of Japan: 2004-269636 A (no date).
Patent Abstracts of Japan: 2001-354837 A (no date).
Ikeda Tadaharu
Osada Shoichi
Tada Tomoyoshi
Tomiyoshi Kazutoshi
Totsuka Kenichi
Feely Michael J
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Shin-Etsu Chemical Co. , Ltd.
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