Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2006-08-22
2006-08-22
Zimmer, Marc S. (Department: 1712)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C428S413000, C428S620000, C523S458000, C523S459000, C523S466000, C524S266000, C524S268000, C525S476000, C525S481000
Reexamination Certificate
active
07095125
ABSTRACT:
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
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Aoki Takayuki
Asano Eiichi
Ino Shigeki
Osada Shoichi
Shiobara Toshio
Birch & Stewart Kolasch & Birch, LLP
Shin-Etsu Chemical Co. , Ltd.
Zimmer Marc S.
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