Semiconductor element-mounting composite heat-sink base

Details Semiconductor element-mounting composite heat-sink base Semiconductor element-mounting composite heat-sink base

1995-04-11

1996-01-02

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257720, 257747, 165 802, 361708, 361709, 361717, H01L 2334, H01L 2352

Patent

active

054811368

ABSTRACT:
A semiconductor-mounting heat-sink base for use with a plastic package or flexible printed wiring board which eliminates the possibility of semiconductor or package reliability being adversely affected due to a difference in thermal expansion coefficient between the heat sink base and the semiconductor or plastic package. The heat-sink base has a semiconductor-mounting portion comprising a Cu--W or Cu--Mo composite alloy containing 5 to 25 wt. % of copper made by an infiltration process, and a portion adjacent to a plastic package which comprises a copper or copper alloy containing not less than 95% of copper.

REFERENCES:
patent: 4788627 (1988-11-01), Ehlert et al.
patent: 5015803 (1991-05-01), Mahulikar et al.
patent: 5111277 (1992-05-01), Medeiros, III et al.
patent: 5113315 (1992-05-01), Capp et al.
patent: 5188985 (1993-02-01), Medeiros, III et al.

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