Semiconductor element and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – With means to increase breakdown voltage threshold – In integrated circuit

Reexamination Certificate

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Details

C257S493000, C257S339000, C257S343000, C257S509000, C257S512000, C257SE27064, C257SE21630

Reexamination Certificate

active

07071527

ABSTRACT:
A p-channel MOSFET (1) includes a semiconductor substrate (2), an epitaxial region (3), a second diffusion region (6), and a drain region. The epitaxial region (3) is formed on the upper surface of the semiconductor substrate (2). The second diffusion region (6) is formed in a predetermined upper surface area of the epitaxial region (3). The second diffusion region (6) has a central portion (6a) and a peripheral portion (6b). The central portion (6a) is formed substantially at the center of the epitaxial region (3) and formed thicker than the peripheral portion (6b). The peripheral portion (6b) is formed in an annular shape so as to surround the central portion (6a). The drain region (7) is formed in an upper surface area of the central portion (6a) of the second diffusion region (6).

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