Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-02-28
2006-02-28
Chapman, John E. (Department: 2856)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C414S752100, C414S941000
Reexamination Certificate
active
07005313
ABSTRACT:
A semiconductor dynamic sensor has a displacement portion, which is composed of a movable electrode and first and second fixed electrodes, formed in a semiconductor substrate. The movable electrode is displaced in response to applied acceleration, so that capacitance between the movable electrode and each of the first and second fixed electrodes changes. Therefore, the applied acceleration can be detected based on the capacitance change. A plurality of rectangular-shaped suction portions is provided at four corners on the surface of the semiconductor substrate. By sucking the suction portions using a collet check, the semiconductor dynamic sensor such can be transported without damaging the displacement portion.
REFERENCES:
patent: 5362681 (1994-11-01), Roberts et al.
patent: 5558482 (1996-09-01), Hiroki et al.
patent: 6276207 (2001-08-01), Sakai et al.
patent: 6383833 (2002-05-01), Silverbrook
patent: 6675666 (2004-01-01), Maruyama et al.
patent: 2001/0055836 (2001-12-01), Kunda
patent: A-S56-87332 (1981-07-01), None
patent: A-H05-235490 (1993-09-01), None
Ikezawa Toshiya
Murata Minoru
Yano Tetsuro
Chapman John E.
Denso Corporation
Posz Law Group , PLC
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