Semiconductor die with protective layer and related method...

Details Semiconductor die with protective layer and related method... Semiconductor die with protective layer and related method...

2011-01-11

2011-01-11

Pham, Thanhha (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S033000, C438S068000, C257SE21599

Reexamination Certificate

active

07867825

ABSTRACT:
A semiconductor die and a related method of processing a semiconductor wafer are disclosed in which a first interlayer insulator having a recess region of varying configuration and defining a scribe line is associated with at least one protective layer formed with a characterizing inclined side surface.

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patent: 2005/0269702 (2005-12-01), Otsuka
patent: 00122737 (1983-07-01), None
patent: 406151584 (1994-05-01), None
patent: 00264489 (1996-10-01), None
patent: WO-2004/097916 (2004-11-01), None

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