Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-12-17
2010-11-16
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S779000, C257S780000, C257SE23020
Reexamination Certificate
active
07834466
ABSTRACT:
A structure includes a semiconductor die that has an arrangement of die pads on a surface of the semiconductor die. A first row of die pads consists of a first group of four die pads and run in a first direction. A second row of die pads are adjacent to the first row and consist of a second group of four die pads running in the first direction. The second row begins at a first offset in the first direction from where the first row begins. A third row of die pads are adjacent to the second row and comprise a third group of four die pads that run in the first direction. The third row begins at a second offset in the first direction from where the second row begins. This allows for relatively easy access to all of the die pads.
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Duong Trung Q
Lidsky Ilan
Wenzel Robert J.
Andújar Leonardo
Arroyo Teresa M
Clingan, Jr. James L.
Freescale Semiconductor Inc.
Vo Kim-Marie
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