Semiconductor die singulation method

Details Semiconductor die singulation method Semiconductor die singulation method

2011-07-26

2011-07-26

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S113000, C438S114000, C438S460000, C438S700000, C438S704000, C438S710000, C438S745000

Reexamination Certificate

active

07985661

ABSTRACT:
In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer.

REFERENCES:
patent: 4820377 (1989-04-01), Davis et al.
patent: 5856705 (1999-01-01), Ting
patent: 5863813 (1999-01-01), Dando
patent: 6140151 (2000-10-01), Akram
patent: 6165814 (2000-12-01), Wark et al.
patent: 6200851 (2001-03-01), Arnold
patent: 6214703 (2001-04-01), Chen et al.
patent: 6342724 (2002-01-01), Wark et al.
patent: 6563204 (2003-05-01), Glenn
patent: 6642127 (2003-11-01), Kumar et al.
patent: 6686225 (2004-02-01), Wachtler
patent: 6897128 (2005-05-01), Arita
patent: 6969669 (2005-11-01), Arita
patent: 7060531 (2006-06-01), Arita
patent: 7129114 (2006-10-01), Akram
patent: 7488668 (2009-02-01), Arita et al.
patent: 7629228 (2009-12-01), Haji et al.
patent: 7678670 (2010-03-01), Arita et al.
patent: 7767551 (2010-08-01), Arita et al.
patent: 7906410 (2011-03-01), Arita et al.
patent: 2004/0102025 (2004-05-01), Arita
patent: 2005/0084996 (2005-04-01), Harper
patent: 2006/0030078 (2006-02-01), Jiang et al.
patent: 2007/0087524 (2007-04-01), Montgomery
patent: 2007/0132034 (2007-06-01), Curello et al.
patent: 2007/0148807 (2007-06-01), Akram
patent: 2008/0213977 (2008-09-01), Wyant
patent: 2009/0001609 (2009-01-01), Lim
patent: 2009/0057838 (2009-03-01), Arita et al.
patent: 2010/0048001 (2010-02-01), Harikai et al.
patent: 2010/0055875 (2010-03-01), Haji et al.
patent: 2010/0124246 (2010-05-01), Lutgen et al.
patent: 2010/0173474 (2010-07-01), Arita et al.
patent: 2004066382 (2004-08-01), None
patent: 2007007883 (2007-01-01), None
patent: 2008081968 (2008-07-01), None
patent: 2009063620 (2009-05-01), None

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