Semiconductor die package including heat sinks

Details Semiconductor die package including heat sinks Semiconductor die package including heat sinks

2007-08-29

2010-06-15

Chu, Chris C (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23087, C257S707000, C257S712000, C438S122000

Reexamination Certificate

active

07737548

ABSTRACT:
A semiconductor die package including at least two heat sinks. The semiconductor die package includes a first heat sink, a second heat sink coupled to the first heat sink, and a semiconductor die between the first heat sink and the second heat sink. The semiconductor die is electrically coupled to the first heat sink and the second heat sink. The semiconductor die may also be attached to a lead.

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