Semiconductor die package including carrier with mask and...

Details Semiconductor die package including carrier with mask and... Semiconductor die package including carrier with mask and...

2007-01-02

2007-01-02

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23021

Reexamination Certificate

active

10455511

ABSTRACT:
A carrier for use in a semiconductor die package is disclosed. In one embodiment, the carrier includes a die attach region and an edge region. A solder mask is on the edge region.

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