Semiconductor die package and integrated circuit package and...

Details Semiconductor die package and integrated circuit package and... Semiconductor die package and integrated circuit package and...

2008-04-08

2011-10-25

Sandvik, Benjamin (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S659000, C257SE23114, C257SE21505

Reexamination Certificate

active

08043892

ABSTRACT:
A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.

REFERENCES:
patent: 2005/0067676 (2005-03-01), Mahadevan et al.
patent: 2006/0145361 (2006-07-01), Yang et al.
patent: 2006-98431 (2006-09-01), None

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