Semiconductor die for plastic encapsulation having an adhesion p

Details Semiconductor die for plastic encapsulation having an adhesion p Semiconductor die for plastic encapsulation having an adhesion p

1988-02-24

1989-05-23

Robinson, Ellis P.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

428 68, 428201, 428209, 428210, 428192, 428426, 428433, 428435, 428417, 4284735, 428458, 428415, 428416, 428901, 174 524, B32B 104

Patent

active

048329967

ABSTRACT:
A semiconductor die for plastic encapsulation having an adhesion promoter selectively disposed on an outer surface enabling better adhesion between the semiconductor die and a plastic encapsulation. The improved adhesion allows for less relative motion between the semiconductor die and the plastic encapsulation. The reduction of relative motion significantly decreases the delamination progression throughout the semiconductor device and allows for an increased semiconductor device lifetime.

REFERENCES:
patent: 4097889 (1978-06-01), Kern et al.
patent: 4518631 (1985-05-01), Antonen
patent: 4632798 (1986-12-01), Eickman et al.
patent: 4719250 (1988-01-01), Eickman et al.
patent: 4720424 (1988-01-01), Eickman et al.
patent: 4721994 (1988-01-01), Mine et al.

Affiliated with

Also associated with

Rating

Semiconductor die for plastic encapsulation having an adhesion p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor die for plastic encapsulation having an adhesion p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor die for plastic encapsulation having an adhesion p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1730114