Semiconductor die bonding with conductive adhesive

Details Semiconductor die bonding with conductive adhesive Semiconductor die bonding with conductive adhesive

1987-03-23

1989-03-07

James, Andrew J.

357 74, H01L 2312, H01L 2310, H01L 2314

Patent

active

048110817

ABSTRACT:
An improved semiconductor assembly includes a semiconductor die that is mounted on a carrier, such as a tape or a substrate, by means of an anisotropically electrically conductive adhesive. The adhesive forms an electrically conductive path between electrical conductors on the carrier and other conductors on the die so that the die can be probe tested before the adhesive is cured and before the die is permanently bonded to the carrier.

REFERENCES:
patent: 3818279 (1974-06-01), Seeger, Jr. et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4577214 (1986-03-01), Schaper
patent: 4631820 (1986-12-01), Harada et al.

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