Semiconductor die bonding apparatus having multiple bonding syst

Details Semiconductor die bonding apparatus having multiple bonding syst Semiconductor die bonding apparatus having multiple bonding syst

1997-10-14

1999-11-09

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 45, 228 491, B23K 100, B23K 3700, B23K 114

Patent

active

059797398

ABSTRACT:
An apparatus for bonding semiconductor dies to lead frame strips, each of the lead frame strips having a plurality of adjacently spaced lead frame units. The apparatus includes at least two bond units, each attaching the dies to one of the lead frame strips at a time and one die supply unit supplying the dies alternately to the bond units. The apparatus also includes at least two lead frame strip supply units, each supplying the lead frame strips to respective ones of the bond units.

REFERENCES:
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4878610 (1989-11-01), Mori et al.
patent: 5173338 (1992-12-01), Sharp et al.
patent: 5397423 (1995-03-01), Bantz et al.
patent: 5836454 (1998-11-01), Evers

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