Semiconductor die analysis as a function of optical...

Optics: measuring and testing – By light interference – For dimensional measurement

Reexamination Certificate

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Reexamination Certificate

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10205780

ABSTRACT:
A light reflected from a semiconductor die is used for enhanced control of substrate removal from the die. According to an example embodiment of the present invention, light reflected from a semiconductor die as it is undergoing substrate removal is used to detect the progress of the substrate removal process, and the removal process is controlled therefrom. In different embodiments, the reflected light is used to detect the removal of a portion of a layer of material in the die and to detect the removal of an entire layer of material.

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