Optics: measuring and testing – By light interference – For dimensional measurement
Reexamination Certificate
2007-03-27
2007-03-27
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
By light interference
For dimensional measurement
Reexamination Certificate
active
10205780
ABSTRACT:
A light reflected from a semiconductor die is used for enhanced control of substrate removal from the die. According to an example embodiment of the present invention, light reflected from a semiconductor die as it is undergoing substrate removal is used to detect the progress of the substrate removal process, and the removal process is controlled therefrom. In different embodiments, the reflected light is used to detect the removal of a portion of a layer of material in the die and to detect the removal of an entire layer of material.
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Birdsley Jeffrey D.
Bruce Michael R.
Goruganthu Rama R.
Advanced Micro Devices , Inc.
Lyons Michael A.
Toatley , Jr. Gregory J.
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