Semiconductor device manufacturing: process
With measuring or testing
Inventor
active
Acoustic 3D analysis of circuit structures
Atomic force microscopy and signal acquisition via buried...
Back side reactive ion etch
Circuit access and analysis for a SOI flip-chip die
Circuit construction in back side of die and over a buried...
No associations
LandOfFree
Jeffrey D. Birdsley does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Jeffrey D. Birdsley, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Jeffrey D. Birdsley will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2034186