Semiconductor die adapter and method of using

Details Semiconductor die adapter and method of using Semiconductor die adapter and method of using

2005-04-19

2005-04-19

Thomas, Tom (Department: 2815)

Semiconductor device manufacturing: process

With measuring or testing

C438S015000, C438S018000, C257S048000, C257S777000, C257S778000, C257S782000, C257S784000

Reexamination Certificate

active

06881593

ABSTRACT:
A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.

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