Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1991-09-05
1993-10-05
LaRoche, Eugene R.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257669, 257671, 257676, H01L 2348, H01L 2328
Patent
active
052508420
ABSTRACT:
In a tape automated bonding (TAB) tape used in a semiconductor device, there is provided at each of the corners of a square opening therein a projection inwards the opening instead of the conventional right angle corner. This projection is left when said opening is cut in the base tape or when metal foil on the base tape is selectively etched. According to the present invention, gap between each corner of the opening and each corner of a semiconductor chip can be reduced in virtue of the above-mentioned projection, this permitting to prevent resin to be applied for coating a semiconductor chip and the inner leads to be bonded to it from dripping through the corner.
REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4994895 (1991-08-01), Matsuzaki et al.
patent: 5031022 (1991-07-01), Yamamoto et al.
patent: 5070039 (1991-12-01), Johnson et al.
LaRoche Eugene R.
NEC Corporation
Nguyen Viet Q.
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