Semiconductor devices including semiconductor dice in...

Details Semiconductor devices including semiconductor dice in... Semiconductor devices including semiconductor dice in...

2011-08-16

2011-08-16

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000, C257S784000

Reexamination Certificate

active

07999378

ABSTRACT:
A semiconductor device assembly includes two or more dice stacked in laterally offset arrangement relative to one another. With such an arrangement, when a second semiconductor die is positioned over a first semiconductor die, bond pads of the first semiconductor die are exposed laterally beyond the second semiconductor die. The semiconductor dice of such an assembly may have similar dimensions and bond pad arrangements. In some embodiments the bond pads of each semiconductor die may be located on the active surface, along a single edge. The multiple chip device enables stacking of a plurality of semiconductor dice in a high density, low profile device.

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