Semiconductor devices having tin-based solder film containing no

Details Semiconductor devices having tin-based solder film containing no Semiconductor devices having tin-based solder film containing no

1999-04-26

2000-07-11

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257677, 257787, 257793, H01L 23495, H01L 2328, H01L 2329

Patent

active

060877146

ABSTRACT:
In a lead frame formed out of at least one metal selected from the group consisting of nickel and nickel alloys, copper and copper alloys and iron and iron alloys, the inner lead part is provided with a surface treatment layer of Ag or an alloy containing silver and the outer lead part is provided at least with a surface treatment layer of an alloy containing silver and tin of the body-centered cubic structure preferentially oriented in the (101) plane and/or the (211) plane. According to the above-mentioned structure, a semiconductor device that uses a lead frame for electronic parts which does not contain lead, one of the environmentally harmful pollutants, has good characteristics including solder wettability and bonding strength and is of low cost and a process for producing the device are provided.

REFERENCES:
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 5167794 (1992-12-01), Ito
patent: 5221859 (1993-06-01), Kobayashi et al.
patent: 5521432 (1996-05-01), Tsuji et al.

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