Semiconductor devices having more than two-rows of pad...

Details Semiconductor devices having more than two-rows of pad... Semiconductor devices having more than two-rows of pad...

2008-07-29

2008-07-29

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C257S773000, C029S846000

Reexamination Certificate

active

07405362

ABSTRACT:
A semiconductor device is provided including a printed circuit board and first, second and third rows of power and/or signal pads on the printed circuit board. A plurality of input and output buffers are also provided. Ones of the plurality of input and output buffers are provided between the first and second rows and others of the plurality of input and output buffers are provided between the second and third rows. Related methods of fabricating semiconductor devices are also provided.

REFERENCES:
patent: 5686764 (1997-11-01), Fulcher
patent: 6301143 (2001-10-01), Fujita et al.
patent: 6560134 (2003-05-01), Brox et al.
patent: 6570812 (2003-05-01), Kono
patent: 6762489 (2004-07-01), Daves et al.
patent: 2000216253 (2000-08-01), None
patent: 2001060625 (2001-03-01), None

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