Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2008-02-25
2011-11-29
Pizarro, Marcos D. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S787000, C257S730000, C257SE23117, C438S127000
Reexamination Certificate
active
08067841
ABSTRACT:
A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
REFERENCES:
patent: 5766985 (1998-06-01), Mangiagli et al.
patent: 6388338 (2002-05-01), Romano′ et al.
patent: 2005/0048699 (2005-03-01), Matsunami
PSI Technologies Inc., Power packages, TO 220 Fullpack (Isolated TO 220), Feb. 12, 2006, http://web.archive.org./web/20060212183151/http://psitechnologies.com/products/to220fullpack.
Deml Gerhard
Doraisamy Stanley Job
Heng Chai Wei
Low Khai Huat Jeffrey
Yong Wae Chet
Infineon - Technologies AG
Montalvo Eva Yan
Pizarro Marcos D.
Slater & Matsil L.L.P.
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