Semiconductor devices having a back surface protective coating

Details Semiconductor devices having a back surface protective coating Semiconductor devices having a back surface protective coating

2006-11-14

2006-11-14

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S460000

Reexamination Certificate

active

07135385

ABSTRACT:
A wafer level method of forming a protective coating on the back surface of integrated circuit devices is described. In one aspect, a tape having a backcoat layer and a mount layer is applied to the back surface of a wafer. The backcoat layer is cured or set such that the backcoat layer is affixed to the back surface of the wafer. Thereafter, the mount layer of the backcoat/mount tape is removed while leaving the backcoat layer affixed to the back surface of the integrated circuit devices. In some embodiments, the mount layer includes an ultraviolet (UV) sensitive adhesive material that releases when exposed to UV light. The described arrangements can be used to form integrated circuits having very thin protective backcoatings. By way of example, opaque protective films having thickness in the range of 5 to 50 microns are readily obtainable.

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