Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction
Patent
1993-02-23
1999-03-09
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Thin active physical layer which is
Heterojunction
H01L 2906, H01L 310328
Patent
active
058804838
ABSTRACT:
A field effect transistor having a substrate supporting an active layer comprising a Group III-V material. The active layer has a dopant concentration with a source electrode and a drain electrode disposed over and with a gate electrode disposed between the source and drain electrodes in Schottky barrier contact to the active layer. A surface layer portion of the active layer has a negatively charged surface potential disposed between the drain and gate electrodes comprised of said Group III-V material and oxygen. The surface layer portion has a thickness in the range of 25 .ANG. to 35 .ANG.. A layer of passivation material is disposed at least on the surface layer portion of the active layer.
REFERENCES:
patent: 4062747 (1977-12-01), Chang et al.
patent: 4688062 (1987-08-01), Liles
patent: 4843450 (1989-06-01), Kirchner et al.
patent: 4990984 (1991-02-01), Misu
patent: 5008719 (1991-04-01), Schrantz
patent: 5011787 (1991-04-01), Jeuch
patent: 5021365 (1991-06-01), Kirchner et al.
Sze "VLSI Technology" 2.sup.nd Ed. McGraw-Hill Book Co N.Y 1983 pp. 266-267, 341-342, and 491-492.
K. Yamasaki and T. Sugano, "Mechanism of Oxide Film Growth on GaAs by Plasma Anodization," J. Vac. Sci. Technol., 17(5), Sep./Oct. 1980, pp. 959-963.
K. Yamasaki and T. Sugano, "Anodic Oxidation of GaAs Using Oxygen Plasma," Japanese Journal of Applied Physics, vol. 17 (1978) Supplement 17-1, pp. 321-326.
R. K. Ahrenkiel and D. J. Dunlavy, "The Density of States at GaAs/Native Oxide Interfaces," Solid-State Electronics vol. 27, No. 5, pp. 485-489, 1984.
F. I. Hshieh, K. N. Bhat, S. K. Ghandhi, and J. M Borrego, "Electrical Characterization of Plasma-Grown Oxide on Gallium Arsenide," J. Appl. Phys. 57(10), 15 May 1985, pp. 4657-4662.
J. G. Tenedorio and P. Z. Terzian, "Effects of Si.sub.3 N.sub.4, SiO and Polyimide Surface Passivations on GaAs MESFET Amplifier RF Stability,"IEEE Electron Dev.Ltrs. vol. EDL-5, No. 6,(84) 199-202.
M. D. Clark and C. L. Anderson, Improvements in GaAs/Plasma-Deposited Silicon Nitride Interface Quality by Predeposition GaAs Surface Treatment and Postdeposition Annealing, J. Vac. Sci. Technol., 21(2), Jul./Aug. 1982 pp. 453-456.
A. Callegari, P. D. Hoh, D. A. Buchanan, and D. Lacey, "Unpinned Gallium Oxide/GaAs Interface by Hydrogen and Nitrogen Surface Plasma Treatment," Appl. Phys. Lett. 54(4) 23 Jan. 1989, pp. 332-334.
S. H. Wemple, M. L. Steinberger, W. O. Schlosser, Relationship Between Power Added Efficiency and Gate-Drain Avalanche in GaAs M.E.S.F.E.T.s, Bell Laboratories, 7 May 1980, pp. 459-460.
Y. Yamane, Y. Ishii, and T. Mizutani, "Degradation-Free P-CVD SiN Deposition on GaAs FETs," Japanese Journal of Applied Physics, vol. 22, No. 6, Jun., 1983, pp. L350-L352.
T. M. Barton and P. H.Ladbrooke, "The Role of the Device Surface in the High Voltage Behaviour of the GaAs MESFET," Solid-State Electronics, vol. 29, No. 8, pp. 807-813, 1986.
H. Mizuta, K. Yamaguchi, and S. Takahashi, "Surface Potential Effect on Gate-Drain Avalanche Breakdown in GaAs MESFET's," IEEE Transactions on Electron Devs, vol.ED-34, No.10,Oct. 87, 2027-2033.
VLSI Fabrication Principles, Silicon and Gallium Arsenide, Sorab K. Ghandhi, John Wiley & Sons, pp. 421-430.
Patel Bharat
Shanfield Stanley R.
Statz Hermann
Jr. Carl Whitehead
Lenzen Glenn H.
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