Semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 2906, H01L 310328

Patent

active

058804838

ABSTRACT:
A field effect transistor having a substrate supporting an active layer comprising a Group III-V material. The active layer has a dopant concentration with a source electrode and a drain electrode disposed over and with a gate electrode disposed between the source and drain electrodes in Schottky barrier contact to the active layer. A surface layer portion of the active layer has a negatively charged surface potential disposed between the drain and gate electrodes comprised of said Group III-V material and oxygen. The surface layer portion has a thickness in the range of 25 .ANG. to 35 .ANG.. A layer of passivation material is disposed at least on the surface layer portion of the active layer.

REFERENCES:
patent: 4062747 (1977-12-01), Chang et al.
patent: 4688062 (1987-08-01), Liles
patent: 4843450 (1989-06-01), Kirchner et al.
patent: 4990984 (1991-02-01), Misu
patent: 5008719 (1991-04-01), Schrantz
patent: 5011787 (1991-04-01), Jeuch
patent: 5021365 (1991-06-01), Kirchner et al.
Sze "VLSI Technology" 2.sup.nd Ed. McGraw-Hill Book Co N.Y 1983 pp. 266-267, 341-342, and 491-492.
K. Yamasaki and T. Sugano, "Mechanism of Oxide Film Growth on GaAs by Plasma Anodization," J. Vac. Sci. Technol., 17(5), Sep./Oct. 1980, pp. 959-963.
K. Yamasaki and T. Sugano, "Anodic Oxidation of GaAs Using Oxygen Plasma," Japanese Journal of Applied Physics, vol. 17 (1978) Supplement 17-1, pp. 321-326.
R. K. Ahrenkiel and D. J. Dunlavy, "The Density of States at GaAs/Native Oxide Interfaces," Solid-State Electronics vol. 27, No. 5, pp. 485-489, 1984.
F. I. Hshieh, K. N. Bhat, S. K. Ghandhi, and J. M Borrego, "Electrical Characterization of Plasma-Grown Oxide on Gallium Arsenide," J. Appl. Phys. 57(10), 15 May 1985, pp. 4657-4662.
J. G. Tenedorio and P. Z. Terzian, "Effects of Si.sub.3 N.sub.4, SiO and Polyimide Surface Passivations on GaAs MESFET Amplifier RF Stability,"IEEE Electron Dev.Ltrs. vol. EDL-5, No. 6,(84) 199-202.
M. D. Clark and C. L. Anderson, Improvements in GaAs/Plasma-Deposited Silicon Nitride Interface Quality by Predeposition GaAs Surface Treatment and Postdeposition Annealing, J. Vac. Sci. Technol., 21(2), Jul./Aug. 1982 pp. 453-456.
A. Callegari, P. D. Hoh, D. A. Buchanan, and D. Lacey, "Unpinned Gallium Oxide/GaAs Interface by Hydrogen and Nitrogen Surface Plasma Treatment," Appl. Phys. Lett. 54(4) 23 Jan. 1989, pp. 332-334.
S. H. Wemple, M. L. Steinberger, W. O. Schlosser, Relationship Between Power Added Efficiency and Gate-Drain Avalanche in GaAs M.E.S.F.E.T.s, Bell Laboratories, 7 May 1980, pp. 459-460.
Y. Yamane, Y. Ishii, and T. Mizutani, "Degradation-Free P-CVD SiN Deposition on GaAs FETs," Japanese Journal of Applied Physics, vol. 22, No. 6, Jun., 1983, pp. L350-L352.
T. M. Barton and P. H.Ladbrooke, "The Role of the Device Surface in the High Voltage Behaviour of the GaAs MESFET," Solid-State Electronics, vol. 29, No. 8, pp. 807-813, 1986.
H. Mizuta, K. Yamaguchi, and S. Takahashi, "Surface Potential Effect on Gate-Drain Avalanche Breakdown in GaAs MESFET's," IEEE Transactions on Electron Devs, vol.ED-34, No.10,Oct. 87, 2027-2033.
VLSI Fabrication Principles, Silicon and Gallium Arsenide, Sorab K. Ghandhi, John Wiley & Sons, pp. 421-430.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1323908

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.