Semiconductor device with solder balls having high reliability

Details Semiconductor device with solder balls having high reliability Semiconductor device with solder balls having high reliability

2010-02-16

2011-12-06

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S653000, C438S612000, C438S661000, C257SE21510

Reexamination Certificate

active

08071472

ABSTRACT:
A semiconductor device includes a substrate, a metal layer, an alloy layer and a Sn—Ag—Cu-based solder ball. The metal layer is configured to be formed on the substrate. The alloy layer is configured to be formed on the metal layer. The Sn—Ag—Cu-based solder ball is configured to be placed on the alloy layer. The alloy layer includes Ni and Zn as essential elements.

REFERENCES:
patent: 6082610 (2000-07-01), Shangguan et al.
patent: 6316726 (2001-11-01), Hidaka et al.
patent: 6638847 (2003-10-01), Cheung et al.
patent: 6916732 (2005-07-01), Wu et al.
patent: 7034402 (2006-04-01), Seshan
patent: 7122894 (2006-10-01), Sugimoto et al.
patent: 7265044 (2007-09-01), Ohta et al.
patent: 7410833 (2008-08-01), Fogel et al.
patent: 7547623 (2009-06-01), Mis et al.
patent: 2001/0040290 (2001-11-01), Sakurai et al.
patent: 2003/0127734 (2003-07-01), Lee et al.
patent: 2005/0006789 (2005-01-01), Tomono et al.
patent: 2006/0030139 (2006-02-01), Mis et al.
patent: 2006/0043570 (2006-03-01), Muramatsu et al.
patent: 2006/0060987 (2006-03-01), Chen et al.
patent: 2006/0102384 (2006-05-01), Watanabe et al.
patent: 2006/0131748 (2006-06-01), Seshan
patent: 2007/0131141 (2007-06-01), Masatoki et al.
patent: 5-50286 (1993-03-01), None
patent: 2001-156207 (2001-06-01), None
patent: 2002-016211 (2002-01-01), None
patent: 2002-185130 (2002-06-01), None
Japanese Office Action, dated May 31, 2011, issued in Application No. 2005-314150.

Affiliated with

Also associated with

Rating

Semiconductor device with solder balls having high reliability does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with solder balls having high reliability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with solder balls having high reliability will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4315076