Semiconductor device with sidewall wiring

Details Semiconductor device with sidewall wiring Semiconductor device with sidewall wiring

2007-09-18

2007-09-18

Doan, Theresa T. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S686000

Reexamination Certificate

active

11206146

ABSTRACT:
Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

REFERENCES:
patent: 3648131 (1972-03-01), Stuby
patent: 3787252 (1974-01-01), Filippazzi et al.
patent: 4954875 (1990-09-01), Clements
patent: 5229647 (1993-07-01), Gnadinger
patent: 5476819 (1995-12-01), Warren
patent: 5682062 (1997-10-01), Gaul
patent: 5895234 (1999-04-01), Taniguchi
patent: 5895970 (1999-04-01), Miyoshi
patent: 5910687 (1999-06-01), Chen et al.
patent: 5998866 (1999-12-01), Ochi
patent: 6002163 (1999-12-01), Wojnarowski
patent: 6184060 (2001-02-01), Siniaguine
patent: 6326689 (2001-12-01), Thomas
patent: 6358772 (2002-03-01), Miyoshi
patent: 6406934 (2002-06-01), Glenn
patent: 6424031 (2002-07-01), Glenn
patent: 6433418 (2002-08-01), Fujisawa
patent: 6485814 (2002-11-01), Moriizumi et al.
patent: 6552426 (2003-04-01), Ishio
patent: 6624505 (2003-09-01), Badehi
patent: 6646289 (2003-11-01), Badehi
patent: 6693358 (2004-02-01), Yamada
patent: 6720661 (2004-04-01), Hanaoka et al.
patent: 6781244 (2004-08-01), Prabhu
patent: 6812573 (2004-11-01), Shimoishizaka
patent: 6828175 (2004-12-01), Wood et al.
patent: 6848177 (2005-02-01), Swan et al.
patent: 6964915 (2005-11-01), Farnworth et al.
patent: 2002/0025587 (2002-02-01), Wada
patent: 2002/0105591 (2002-08-01), Nakamura et al.
patent: 2002/0110953 (2002-08-01), Ahn et al.
patent: 2002/0185725 (2002-12-01), Moden
patent: 2003/0077878 (2003-04-01), Kumar et al.
patent: 2003/0094683 (2003-05-01), Poo et al.
patent: 2003/0134453 (2003-07-01), Prabhu et al.
patent: 2003/0230805 (2003-12-01), Noma et al.
patent: 2004/0041260 (2004-03-01), Wood et al.
patent: 2006/0079019 (2006-04-01), Kim
patent: 2007/0026639 (2007-02-01), Noma et al.
patent: 03 01 0938.3-1528 (2003-10-01), None
patent: 2 767 223 (1999-02-01), None
patent: H09-46566 (1997-02-01), None
patent: S63-014169 (2000-01-01), None
patent: H05-41758 (2000-02-01), None
patent: H11-240202 (2000-09-01), None
patent: H11-275361 (2000-10-01), None
patent: H07-319369 (2000-11-01), None
patent: 2001-77229 (2001-03-01), None
patent: 2002-93942 (2002-03-01), None
patent: 2002-231918 (2002-08-01), None
patent: 2002-329849 (2002-11-01), None
patent: 10-0410812 (2004-01-01), None
patent: WO 99/40624 (1999-08-01), None
European Office Action mailed Apr. 10, 2006, directed to counterpart EP Application No. 03010938.3.
European Office Action dated Aug. 10, 2005, directed to counterpart foreign application.

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