Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2008-04-29
2008-04-29
Estrada, Michelle (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S784000, C257SE21503
Reexamination Certificate
active
07365438
ABSTRACT:
The present invention relates to a semiconductor device which provides a shortest possible connection between two semiconductor components10aand10barranged in a manner lying opposite on a substrate2. The two semiconductor components10aand10bare in each case arranged with their chip contact-connection regions11aand11bfacing the substrate2. A vertical through-plating device20connects the two chip contact-connection regions11aand11b.
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Hedler Harry
Muff Simon
Estrada Michelle
Infineon - Technologies AG
Jenkins Wilson Taylor & Hunt, P.A.
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