Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2011-02-08
2011-02-08
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S108000, C438S109000, C438S123000, C257S702000
Reexamination Certificate
active
07883993
ABSTRACT:
The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.
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Fuergut Edward
Vilsmeier Hermann
Woerner Holger
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Landau Matthew C
Mitchell James M
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