Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-05-21
2000-01-04
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257692, 257790, H01L 2348
Patent
active
060113022
ABSTRACT:
A semiconductor device includes a resin case for covering a semiconductor element, and main terminal frames for externally guiding electrodes of the semiconductor element. The main terminal frames with different polarities are installed inside the resin case such that relative positions thereof are offset in a vertical direction to form upper and lower sides. Main terminal pieces are connected to the respective terminal frames to protrude vertically from a top surface of the resin case. The main terminal pieces have rising bases connected to the terminal fames, wherein the rising base and the terminal frame connected thereto which are located at the upper side are sealed with a material same as the resin case. A gel sealing resin is charged into the resin case to seal at least one terminal frame installed at the lower side. Thus, the amount of the gel sealing resin for filling the resin case is reduced to prevent the overflow of the resin while maintaining the required insulation between the terminals with the different polarities.
REFERENCES:
patent: 5243223 (1993-09-01), Yamada et al.
patent: 5471089 (1995-11-01), Nagatomo et al.
Fuji Electric & Co., Ltd.
Jr. Carl Whitehead
Potter Roy
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