Semiconductor device with package

Details Semiconductor device with package Semiconductor device with package

1998-03-23

2000-04-04

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257795, H01L 2328

Patent

active

060465069

ABSTRACT:
A semiconductor device includes an IC chip. The IC chip is die-bonded on a mounting base, and encapsulated by a resin package. A flexible film such as a silicone resin film is interposed between the IC chip and the resin package. This flexible film serves to prevent the filler particles mixed in a synthetic resin as a resin package material from caving in a circuit element formed on the IC chip.

REFERENCES:
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5278451 (1994-01-01), Adachi et al.
patent: 5406117 (1995-04-01), Diugokecki et al.
patent: 5543664 (1996-08-01), Burns
patent: 5561329 (1996-10-01), Mine et al.
patent: 5793118 (1998-08-01), Nakajima

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