Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-02-09
2009-06-30
Le, Thao X (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S691000, C438S123000
Reexamination Certificate
active
07554181
ABSTRACT:
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in series. In the non-insulated type DC-DC converter, the power transistor for the high side switch, the power transistor for the low side switch, and driver circuits that drive these are respectively constituted by different semiconductor chips. The three semiconductor chips are accommodated in one package, and the semiconductor chip including the power transistor for the high side switch, and the semiconductor chip including the driver circuits are disposed so as to approach each other.
REFERENCES:
patent: 4766479 (1988-08-01), Krum et al.
patent: 6040626 (2000-03-01), Cheah et al.
patent: 6184585 (2001-02-01), Martinez et al.
patent: 6521987 (2003-02-01), Glenn et al.
patent: 6717260 (2004-04-01), Pavier et al.
patent: 6940724 (2005-09-01), Divakar et al.
patent: 6946740 (2005-09-01), Schaffer
patent: 2002/0021560 (2002-02-01), Jauregui
patent: 2003/0098468 (2003-05-01), Wheeler et al.
patent: 2004/0004272 (2004-01-01), Luo et al.
patent: 2004/0217488 (2004-11-01), Luechinger
patent: 2005/0231990 (2005-10-01), Uno et al.
patent: 2001-025239 (2001-01-01), None
patent: 2002-217416 (2002-08-01), None
patent: 2004-055756 (2004-02-01), None
patent: 2004-342735 (2004-12-01), None
Matsuura Nobuyoshi
Satou Yukihiro
Shiraishi Masaki
Uno Tomoaki
Arora Ajay K
Le Thao X
Miles & Stockbridge P.C.
Renesas Technology Corp.
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