Semiconductor device with lead-free solder

Details Semiconductor device with lead-free solder Semiconductor device with lead-free solder

2007-08-21

2007-08-21

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S772000, C257S783000

Reexamination Certificate

active

10104826

ABSTRACT:
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

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