Semiconductor device with interlocking clip

Details Semiconductor device with interlocking clip Semiconductor device with interlocking clip

2007-09-04

2007-09-04

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S122000, C438S123000, C438S117000, C029S243560

Reexamination Certificate

active

11441569

ABSTRACT:
A semiconductor device is provided having a single-piece clip that interlocks into a lead frame using one or more forks on the clip that mate with one or more corresponding slots in the lead frame. A semiconductor die is mounted to a pad of the lead frame and the clip couples the die to a conductive lead of the lead frame. The interlocking coupling forms a lever that allows adjustment of a position of the clip relative to a region of the semiconductor die. Interference between the clip fork and a slot corresponding to the clip fork confines the lever motion or pivoting of the clip relative to the mounted semiconductor die. The coupling between the clip fork and the slot furthermore confines motion of the clip in each of a first dimension and a second dimension relative to a position of the lead frame.

REFERENCES:
patent: 4803545 (1989-02-01), Birkle
patent: 5350713 (1994-09-01), Liang
patent: 5834842 (1998-11-01), Majumdar et al.
patent: 6351034 (2002-02-01), Farnworth et al.
patent: 6396127 (2002-05-01), Munoz et al.
patent: 6587344 (2003-07-01), Ross
patent: 6608373 (2003-08-01), Wu et al.
patent: 6684572 (2004-02-01), Homolka et al.
patent: 6762067 (2004-07-01), Quinones et al.
patent: 2003/0052408 (2003-03-01), Quinones et al.

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