Semiconductor device with increased on chip decoupling capacitan

Details Semiconductor device with increased on chip decoupling capacitan Semiconductor device with increased on chip decoupling capacitan

1996-08-02

1997-09-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257738, 257758, 257780, H01L 2900, H01L 2348

Patent

active

056683995

ABSTRACT:
A semiconductor device has an on-board decoupling capacitor provided at its interconnect region. The decoupling capacitor comprises two layers of metallurgy separated by a dielectric layer wherein two of the layers are identically patterned.

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Takken et al., "Integral Decoupling Capacitance Reduces Multichip Module Ground Bounce," IEEE, pp. 79-84, Jan. 1993.
Fitzgerald, F.C. et al. "On-Chip Decoupling Capacitors For VLSI Gate Array and Master Image Products", IBM Technical Disclosure Bulletin, vol. 31, No. 8, pp. 381-382, Jan. 1989.
Geldermans et al., "Packaging Structure With The Ground Plane On Top Of The Wiring," IBM Technical Disclosure Bulletin, vol. 25, No. 8, pp. 4418-4420, Jan. 1983.

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