Semiconductor device with improved pad connection

Details Semiconductor device with improved pad connection Semiconductor device with improved pad connection

1999-03-22

1999-11-16

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257786, 257781, 257698, H01L 2348, H01L 2352, H01L 2940

Patent

active

059863463

ABSTRACT:
A semiconductor device includes a semiconductor chip and a wiring formed on the chip. An interlayer film is located on the wiring. A pad is located on the interlayer film and is connected to the wiring with contacts that extend from the wiring, through the interlayer film, to the pad. The contacts include a first group of contacts located near the perimeter of the pad and a second group of pads located near the center of the pad. By limiting the number and placement of the contacts, the pad allows for a secure connection between the pad and the wiring and between the pad and a bonding wire.

REFERENCES:
patent: 5248903 (1993-09-01), Heim
patent: 5367195 (1994-11-01), DiGiacomo et al.
patent: 5442239 (1995-08-01), DiGiacomo
patent: 5502337 (1996-03-01), Nozaki et al.
patent: 5736791 (1998-04-01), Fujiki et al.

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