Semiconductor device with improved mounting on tape-shaped insul

Details Semiconductor device with improved mounting on tape-shaped insul Semiconductor device with improved mounting on tape-shaped insul

1998-12-04

2000-05-09

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257746, 257778, H01L 2940

Patent

active

060607823

ABSTRACT:
In a substrate, a device hole is punched, and a metal wiring pattern is formed on the substrate. Then, an insulating film is formed from the side of the metal wiring pattern so as to cover at least the device hole. In this state, the insulating film is formed for fixing the inner leads of the metal wiring pattern, which are projected on the device hole. Then, the semiconductor chip is provided so as to face the device hole from the side of the substrate, and the electrode is connected to the inner leads via the ACF by thermocompression. The described arrangement is provided so as to realize an extremely narrow frame in a liquid crystal module. According to the described method, a quality TCP semiconductor device can be manufactured in a simple manner at high yield.

REFERENCES:
patent: 4811081 (1989-03-01), Lyden

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