Semiconductor device with improved bonding pad connection...

Details Semiconductor device with improved bonding pad connection... Semiconductor device with improved bonding pad connection...

2005-10-11

2005-10-11

Munson, Gene M. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S203000, C257S786000

Reexamination Certificate

active

06953997

ABSTRACT:
A semiconductor apparatus includes a substrate with a peripheral edge. A plurality of devices are situated on the substrate and adjacent the peripheral edge, with each device including a first end adjacent the peripheral edge and a second end opposite the first end. A connector port is located between the first end and the second end on each device. A bonding pad is situated atop a portion of each device and coupled to each device by a connector connected to the connector port. Each connector has a connection path of approximately equal length.

REFERENCES:
patent: 5796171 (1998-08-01), Koc et al.
patent: 6100573 (2000-08-01), Lu et al.
patent: 6150727 (2000-11-01), Takagi
patent: 6191491 (2001-02-01), Hiraga
patent: 6710448 (2004-03-01), Wang
patent: 6768142 (2004-07-01), Ali et al.
patent: 6784558 (2004-08-01), Jassowski

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