Semiconductor device with fuse box and method for...

Details Semiconductor device with fuse box and method for... Semiconductor device with fuse box and method for...

2006-01-03

2006-01-03

Nguyen, Cuong (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S281000, C438S132000

Reexamination Certificate

active

06982219

ABSTRACT:
A semiconductor device comprises a semiconductor substrate having a bonding pad region; and a bonding pad and a fuse box formed in the bonding pad region. Thus, the chip size can be reduced and the manufacturing yield can be increased.

REFERENCES:
patent: 5985765 (1999-11-01), Hsiao et al.
patent: 6242789 (2001-06-01), Weber et al.
patent: 6677226 (2004-01-01), Bowen et al.

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