Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-07-19
2005-07-19
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S637000, C438S672000
Reexamination Certificate
active
06919265
ABSTRACT:
In a semiconductor device with multiple wiring layers, to connect a conductive line in a lower wiring layer to a conductive line in an upper wiring layer, two conductive members are formed in the space between the upper and lower conductive layers, one conductive member in contact with each conductive line. The two conductive members meet in the space between the two conductive layers to form an electrical path between the two conductive lines. One or both of the conductive members may have a rectangular bar shape extending lengthwise along the conductive line with which it makes contact. The conductive members can have a reduced height and enlarged area that enables interconnections to be formed with greater stability and reliability than by conventional methods.
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Oki Electric Industry Co. Ltd.
Pert Evan
Rabin & Berdo PC
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