Semiconductor device with electrode pad having probe mark

Details Semiconductor device with electrode pad having probe mark Semiconductor device with electrode pad having probe mark

2007-10-09

2007-10-09

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C438S014000, C438S015000, C438S018000

Reexamination Certificate

active

10958413

ABSTRACT:
A semiconductor device is formed by bonding bonding balls to a plurality of electrode pads formed on a semiconductor chip. After a wafer test is conducted by pressing a probe against the electrode pad, wire-bonding of the electrode pad to a lead is carried out so that a probe mark formed in the electrode pad during the wafer test is completely covered by a bonding ball, which forms an end of a wire connected to the lead.

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patent: 10-56030 (1998-02-01), None
patent: 2001-338955 (2001-12-01), None

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